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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required

Categories Phase Changing Materials
Brand Name: Ziitek
Model Number: TIC™803A
Certification: RoHs
Place of Origin: China
MOQ: 1000PCS
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5days
Packaging Details: 1000pcs/bay
Product Name: Phase Changing Materials
Color: Gray
Thermal Conductivity: 2.5 W/mK
phase transition temperature: 50℃~60℃
Density: 2.5g/cc
Work Temperature: -25℃~125℃
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    2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required

    2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive


    The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


    The TIC™803A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.



    Features:


    > 0.018℃-in² /W thermal resistance
    > Naturally tacky at room temperature, no adhesive required
    > No heat sink preheating required


    Applications:


    > High Frequency Microprocessors

    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs


    Typical Properties of TIC™800A Series
    Product Name
    TICTM803A
    TICTM805A
    TICTM808A
    TICTM810A
    Testing standards
    Color
    Ashy
    Ashy
    Ashy
    Ashy
    Visual
    Composite Thickness
    0.003"
    (0.076mm)
    0.005"
    (0.126mm)
    0.008"
    (0.203mm)
    0.010"
    (0.254mm)
     
    Thickness Tolerance
    ±0.0006"
    (±0.016mm)
    ±0.0008"
    (±0.019mm)
    ±0.0008"
    (±0.019mm)
    ±0.0012"
    (±0.030mm)
     
    Density
    2.5g/cc
    Helium Pycnometer
    Work Temperature
    -25℃~125℃
     
    phase transition temperature
    50℃~60℃
     
    Setting temperature
    70℃ for 5 minutes
     
    Thermal conductivity
    2.5 W/mK
    ASTM D5470 (modified)
    Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
    0.018℃-in²/W
    0.020℃-in²/W
    0.047℃-in²/W
    0.072℃-in²/W
    ASTM D5470 (modified)
    0.11℃-cm²/W
    0.13℃-cm²/W
    0.30℃-cm²/W
    0.46℃-cm²/W
    Standard Thicknesses:

    0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
    Consult the factory alternate thickness.

    Standard Sizes:

    9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

    Peressure Sensitive Adhesive:

    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

    Reinforcement:

    No reinforcement is necessary.
    Quality 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required for sale
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